CVE-2023-32096

CVSS v3 Score
7.5
High

Vulnerability Description

Compiler removal of buffer clearing in sli_crypto_transparent_aead_encrypt_tag in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CVSS:7.5(High)

Compiler removal of buffer clearing in sli_cryptoacc_transparent_key_agreement in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023
CVSS:7.5(High)

Compiler removal of buffer clearing in sli_se_driver_key_agreement in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023
CVSS:7.5(High)

Compiler removal of buffer clearing in sli_se_opaque_import_key in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023
CVSS:7.5(High)

Compiler removal of buffer clearing in sli_crypto_transparent_aead_decrypt_tag in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023
CVSS:7.5(High)

Compiler removal of buffer clearing in sli_se_sign_message in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023
CVSS:7.5(High)

Compiler removal of buffer clearing in sli_se_sign_hash in Silicon Labs Gecko Platform SDK v4.2.1 and earlier results in key material duplication to RAM.

CWE-142023